Anchor design and method for mems transducer apparatuses

ABSTRACT

An improved MEMS transducer apparatus and method. The method includes providing a movable base structure having a base surface region overlying a substrate and a center cavity with a cavity surface region. At least one center anchor structure and one spring structure can be spatially disposed within a substantially circular portion of the surface region. The spring structure(s) can be coupled the center anchor structure(s) to a portion of the cavity surface region. The substantially circular portion can be configured within a vicinity of the center of the surface region. At least one capacitor element, having a fixed and a movable capacitor element, can be spatially disposed within a vicinity of the cavity surface region. The fixed capacitor element(s) can be coupled to the center anchor structure(s) and the movable capacitor element(s) can be spatially disposed on a portion of the cavity surface region.

CROSS-REFERENCES TO RELATED APPLICATIONS

The present application is a divisional application of and incorporatesby reference, for all purposes, U.S. patent application No. 12/859,647,filed Aug. 19, 2010.

BACKGROUND OF THE INVENTION

The present invention relates generally to integrated devices. Morespecifically, the present invention provides an integrated transducerapparatus that can be used in combination with other MEMS devices, butcan have other uses as well. Merely by way of example, the MEMS devicescan include at least an accelerometer, an angular rate sensor, amagnetic field sensor, a pressure sensor, a microphone, a humiditysensor, a temperature sensor, a chemical sensor, a biosensor, aninertial sensor, and others. But it will be recognized that theinvention has a much broader range of applicability.

Research and development in integrated microelectronics have continuedto produce astounding progress in CMOS and MEMS technology. CMOStechnology has become the predominant fabrication technology forintegrated circuits (IC). In layman's terms, microelectronic ICs are the“brains” of an integrated device which provides decision-makingcapabilities, whereas MEMS are the “eyes” and “arms” that provide theability to sense and control the environment. Some examples of thewidespread application of these technologies are the switches in radiofrequency (RF) antenna system, such as those in the iPhone™ or iPad™device by Apple, Inc. of Cupertino, Calif., and the Blackberry™ phone byResearch In Motion Limited of Waterloo, Ontario, Canada, andaccelerometers in sensor-equipped game devices, such as those in theWii™ controller manufactured by Nintendo Company Limited of Japan.Though they are not always easily identifiable, these technologies arebecoming more prevalent in society every day.

Beyond consumer electronics, use of IC and MEMS technology has limitlessapplications through modular measurement devices such as accelerometers,angular rate sensors, actuators, and other sensors. In conventionalvehicles, accelerometers and angular rate sensors are used to deployairbags and trigger dynamic stability control functions, respectively.MEMS angular rate sensors can also be used for image stabilizationsystems in video and still cameras, automatic steering systems inairplanes and guided munitions, or the like. MEMS can also be in theform of biological MEMS (Bio-MEMS) that can be used to implementbiological and/or chemical sensors for Lab-On-Chip applications. Suchapplications may integrate one or more laboratory functions on a singlemillimeter-sized chip. Other applications include Internet and telephonenetworks, security and financial applications, and health care andmedical systems. As described previously, ICs and MEMS can be used topractically engage in various type of environmental interaction.

Although highly successful, ICs and in particular MEMS still havelimitations. Additionally, applications of MEMS often requireincreasingly complex microsystems that desire greater computationalpower. Unfortunately, such applications generally do not exist.

From the above, it is seen that techniques for improving operation of ICdevices and MEMS are highly desired.

BRIEF SUMMARY OF THE INVENTION

This invention relates generally to integrated devices. Morespecifically, the present invention provides an integrated transducerapparatus that can be used in combination with other Micro-ElectroMechanical Systems (MEMS) devices, but can have other uses as well. Forexample, the MEMS devices can include at least an accelerometer, anangular rate sensor, a magnetic field sensor, a pressure sensor, amicrophone, a humidity sensor, a temperature sensor, a chemical sensor,a biosensor, an inertial sensor, and others.

In a specific embodiment, the present invention provides an integratedtransducer apparatus disposed upon a substrate member having a surfaceregion. The apparatus has a movable base structure having a base surfaceregion. At least one anchor structure can be spatially disposed within asubstantially circular portion of the surface region. The substantiallycircular portion can be configured within a vicinity of the center ofthe surface region. At least one spring structure can be coupled to theanchor structure(s) and at least one portion of the base surface region.At least one capacitor element, having a fixed capacitor element and amovable capacitor element, can also be spatially disposed within avicinity of the base surface region. The fixed capacitor element(s) canbe coupled to the anchor structure(s) and the movable capacitorelement(s) can be spatially disposed on a portion of the base surfaceregion within a vicinity of the anchor structure(s). The anchor(s) forthe fixed capacitor elements present and the anchor(s) for the springelements present can all be disposed within the substantially circularportion of the surface region. The smaller the circular portion can bemade, the less sensitive the MEMS device will be to externaldeformations.

A substantially circular shape for the portion can reduce and/orminimize the separation that is possible between any two anchors or anytwo locations within a single anchor. Depending on the specific design,the substantially circular portion shape can typically be approximatedby a polygon. For example, an octagon is much closer to a circle than asquare, but not as close as a dodecagon. The technology will typicallynot be able to reproduce a true circle, however.

Many benefits are achieved by way of the present invention overconventional techniques. For example, the present technique provides aneasy to use process that relies upon conventional technology. In someembodiments, the present invention provides improved tolerance ofexternal deformations. Additionally, the method provides a process andapparatus that are compatible with conventional process technologywithout substantial modifications to conventional equipment andprocesses. Preferably, the invention provides for an improved MEMSdevice apparatus and related applications for a variety of uses. Inother embodiments, the present invention provides an improved MEMStransducer apparatus, which may be integrated on at least one integratedelectronic device structure. Depending upon the embodiment, one or moreof these benefits may be achieved. These and other benefits will bedescribed in more throughout the present specification and moreparticularly below.

Various additional objects, features and advantages of the presentinvention can be more fully appreciated with reference to the detaileddescription and accompanying drawings that follow

BRIEF DESCRIPTION OF THE DRAWINGS

The diagrams disclosed in the present patent application are merelyimplementation examples, which should not unduly limit the scope of theclaims herein. It should be understood that the examples and embodimentsdescribed herein are for illustrative purposes only and that variousmodifications or changes in light thereof will be suggested to personsskilled in the art and are to be included within the spirit and purviewof this process and scope of the appended claims.

FIG. 1 is a simplified top diagram of a transducer apparatus accordingto an embodiment of the present invention;

FIG. 2 is a simplified perspective diagram of a transducer apparatusaccording to an embodiment of the present invention;

FIG. 3 is a simplified cross-sectional side diagram of a transducerapparatus according to an embodiment of the present invention;

FIG. 4 is a simplified cross-sectional close-up diagram of a transducerapparatus according to an embodiment of the present invention;

FIG. 5 is a simplified flow diagram of a transducer apparatus accordingto an embodiment of the present invention; and

FIG. 6 is a simplified block diagram of a device incorporating variousembodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

This invention provides an improved MEMS transducer apparatus that canbe used with other MEMS devices, as well as other devices. FIG. 1 is asimplified top diagram of a transducer apparatus disposed on a substratehaving a surface region according to an embodiment of the presentinvention. As shown, apparatus 100 includes a movable base structure110, at least one anchor structure 120, at least one spring structure150, and at least one capacitor element 160. In an embodiment, apparatus100 can be configured to improve tolerance of external deformations.

In an embodiment, movable base structure 110 can have an base surfaceregion and at least one portion removed by an etching, mechanical, orother process. In a specific embodiment, movable base structure 110 canbe fabricated from a single crystal silicon, polycrystalline silicon,amorphous silicon, or the like. Moveable base structure 110 can alsoinclude a thickness of a polymer or a thickness of a metal material. Inother embodiments, movable base structure 110 can include othermaterials and combinations thereof. In a specific embodiment, movablebase structure 110 can be a rectangular movable base structure, apatterned polygonal base structure, or virtually any other shaped basestructure. Also, various portions of the movable base structure can beetched to at least one inner surface region.

In an embodiment, capacitor element(s) 460 can include a fixed capacitorelement and a movable capacitor element. The fixed capacitor element(s)can be coupled to the anchor structure(s) and the movable capacitorelement(s) can be spatially disposed on a portion of the base surfaceregion within a vicinity of the anchor structure(s). The capacitorelement(s) can be tall vertical structures, which can include siliconmaterials and the like. In an embodiment, apparatus 400 can beconfigured to improve tolerance of external deformations. Capacitorelement(s) 460 can be spatially disposed within a vicinity of innersurface region(s) 402 of the movable base structure. Capacitorelement(s) 460 can also include differential capacitor element pair(s).In a specific embodiment, the differential capacitor element pair(s) canoperate during motion of movable base structure 410. The charge on oneelement of the pair can increase while the charge on the othercomplementary element can decrease. Each differential pair can also bespatially disposed within a vicinity of inner surface region(s) 402, andeach pair can be disposed within a vicinity of its own inner surfaceregion, isolated from other pairs.

In various embodiment, anchor structure(s) 120 can be restricted to bespatially disposed within a substantially circular portion of thesurface region. Anchor structure(s) 120 can also be configured within avicinity of the center of the surface region. In a specific embodiment,anchor structure(s) 120 can include single crystal silicon,polycrystalline silicon, or amorphous silicon. Anchor structure(s) 120can also include a polymer or metal material, or other materials orcombinations thereof. In various embodiments, anchor structure(s) 120can be formed overlying an oxide material, which can be formed overlyingthe substrate. In various embodiments, various portions of the oxidematerial are etched to form a space between movable base structure 100and the substrate.

In an embodiment, spring structure(s) 130 can be operably coupled to theanchor structure(s) 120 and at least one portion of the base surfaceregion of movable base structure 110. In a specific embodiment, springstructure(s) 130 can be formed from single crystal silicon,polycrystalline silicon, amorphous silicon, or the like. Springstructure(s) 130 can also include a polymer or metal material, or othermaterials or combinations thereof. In a specific embodiment, springstructure(s) 130 can be spatially oriented to be 45 degrees or (pi/4)radians to the edges of a die. Thus, spring structure(s) 130 would bediagonally aligned to the center of movable base structure 110. Also,each of spring structure(s) 130 can have at least one segment having asegment length. Each of the segments of spring structure(s) 130 can beseparated by folds, as shown in FIG. 1.

In an embodiment, apparatus 100 can include at least one capacitorelement spatially disposed within a vicinity of the base surface regionof movable base structure 110. Also, the configuration of springstructure(s) 130 can depend on the configuration of the capacitorelement(s). The capacitor element(s) can include a fixed capacitorelement and a movable capacitor element. The movable capacitor elementcan be disposed on a portion of the movable base structure and the fixedcapacitor element can be disposed on a portion of the anchorstructure(s). In a specific embodiment, the physical basis of apparatus100 is to have anchor(s) 120 for spring structure(s) 130 and theanchor(s) for the fixed capacitor elements to be located as close aspossible to each other so that their deformations will be nearly thesame.

In an embodiment, apparatus 100 can be coupled to another MEMS device oran electronic device. In a specific embodiment, apparatus 100 can beconfigured to be tolerant of external deformations. Apparatus 100 can bean integrated transducer apparatus with minimal separation betweenanchor structure(s) 120 and thus minimal difference of strain ordeformation of the anchor structure(s). In some embodiments, thisconfiguration can result in minimal change in sense capacitance valuesover strain and deformation due to temperature. There can be othervariations, modifications, and alternatives as well.

FIG. 2 is a simplified perspective diagram of a transducer apparatusaccording to an embodiment of the present invention. As shown, apparatus100 includes a movable base structure 110, at least one anchor structure120, at least one spring structure 130, and at least one capacitorelement 160. In an embodiment, apparatus 100 can be configured toimprove tolerance of external deformations. A detailed descriptionregarding the elements and configuration of apparatus 100 can be foundabove in the description for FIG. 1.

In an embodiment, the present apparatus can include a movable basestructure having a base surface region. The movable base can have acenter cavity with a cavity surface region. At least one center anchorstructure can be spatially disposed within a substantially circularportion of the surface region of the substrate. These anchorstructure(s) can be configured within a vicinity of the center of thesurface region that is within the center cavity. At least one springstructure can be coupled to at least one portion of the cavity surfaceregion and the center anchor structure(s). At least one capacitorelement, which can include a fixed and a movable capacitor element, canbe coupled to the center anchor structure(s), with the movable capacitorelements disposed on a portion of the cavity surface region and thefixed capacitor elements being coupled to the center anchorstructure(s).

In a specific embodiment, the present apparatus can include arectangular movable base structure having a base surface region. Therectangular movable base can have a center cavity with a cavity surfaceregion. Four anchor structures can be spatially disposed within asubstantially circular portion of the surface region of the substrate.These anchor structures can be configured within a vicinity of thecenter of the surface region that is within the center cavity. Fourspring structures can be coupled to separate portions of the cavitysurface region and to the center anchor structures. At least onecapacitor element, which can include a fixed and a movable capacitorelement, can be coupled to each of the center anchor structures, withthe movable capacitor elements being disposed on a portion of the cavitysurface region and the fixed capacitor elements being coupled to thecenter anchor structures.

FIG. 3 is a simplified cross-sectional side diagram of a transducerapparatus according to an embodiment of the present invention. As shown,apparatus 100 includes a movable base structure 110, at least one anchorstructure 120, at least spring structure 130, and at least one capacitorelement 160. In an embodiment, apparatus 100 can be configured toimprove tolerance of external deformations. A detailed descriptionregarding the elements and configuration of apparatus 100 can be foundabove in the description for FIG. 1.

FIG. 4 is a simplified cross-sectional close-up diagram of a transducerapparatus according to an embodiment of the present invention. As shown,apparatus 400 includes a movable base structure 410 and at least onecapacitor element 460. In an embodiment, capacitor element(s) 460 caninclude a fixed capacitor element and a movable capacitor element. Thefixed capacitor element(s) can be coupled to the anchor structure(s) andthe movable capacitor element(s) can be spatially disposed on a portionof the base surface region within a vicinity of the anchor structure(s).The capacitor element(s) can be tall vertical structures, which caninclude silicon materials and the like. In an embodiment, apparatus 400can be configured to improve tolerance of external deformations.Capacitor element(s) 460 can be spatially disposed within a vicinity ofinner surface region(s) 402 of the movable base structure. Capacitorelement(s) 460 can also include differential capacitor element pair(s).In a specific embodiment, the differential capacitor element pair(s) canoperate during motion of movable base structure 410. The charge on oneelement of the pair can increase while the charge on the othercomplementary element can decrease. Each differential pair can also bespatially disposed within a vicinity of inner surface region(s) 402, andeach pair can be disposed within a vicinity of its own inner surfaceregion, isolated from other pairs. A detailed description regarding thecomponents and configuration of apparatus 400 can be found above in thedescription for FIG. 1.

FIG. 5 is a simplified flow diagram illustrating a method forfabricating a transducer apparatus according to an embodiment of thepresent invention.

As shown in FIG. 5, the present method can be briefly outlined below.

1. Start;

2. Provide a substrate member;

3. Form a movable base structure;

4. Pattern the movable base structure

5. Form at least one anchor structure;

6. Form at least one spring structure;

7. Form at least one capacitor element; and

8. Stop.

These steps are of a preferred implementation and should not undulylimit the scope of the claims herein. As shown, the above methodprovides a way of fabricating a transducer apparatus according to anembodiment of the present invention.

As shown in FIG. 5, method 500 begins at start, step 502. The presentmethod provides a fabrication method for forming a MEMS transducerapparatus. Many benefits are achieved by way of the present inventionover conventional techniques. For example, the present techniqueprovides an easy to use process that relies upon conventionaltechnology. In some embodiments, the present invention provides improvedtolerance of external deformations. Additionally, the method provides aprocess and system that are compatible with conventional processtechnology without substantial modifications to conventional equipmentand processes. Preferably, the invention provides for an improvedintegrated micro electro-mechanical systems and electronic devices andrelated methods for a variety of uses.

Following step 502, a substrate member having a surface region can beprovided, step 504. The substrate member can include single crystal,polycrystalline, or amorphous silicon. A movable base structure can beformed overlying the surface region, step 506, which can have a basesurface region. In a specific embodiment, the movable base structure caninclude a single crystal silicon, polycrystalline silicon, or amorphoussilicon. The moveable base structure can also include a thickness of apolymer or a thickness of a metal material. In other embodiments, themovable base structure can include other materials and combinationsthereof. Additionally, the movable base structure can have at least oneportion removed by an etching process, mechanical process, or otherprocess, step 508. Etching the movable base structure can form at leastone inner surface region where portions are removed.

Next, at least one anchor structure can be formed and spatially disposedwithin a substantially circular portion of the surface region, step 510.The anchor structures can also be configured within a vicinity of thecenter of the surface. In a specific embodiment, the anchor structure(s)can include single crystal silicon, polycrystalline silicon, oramorphous silicon. The anchor structures can also include a polymer ormetal material, or other materials or combinations thereof.

After forming the anchor structure(s), at least one spring structure canbe formed and operably coupled to the anchor structure(s) and at leastone portion of the base surface region(s) of movable base structure,step 512. In a specific embodiment, the spring structure(s) can includesingle crystal silicon, polycrystalline silicon, or amorphous silicon.The spring structures can also include a polymer or metal material, orother materials or combinations thereof. In a specific embodiment, thespring structure(s) can be spatially oriented to be 45 degrees or (pi/4)radians to the edges of a die.

At least one capacitor element can be formed spatially disposed within avicinity of the base surface region of the movable base structure, step518. In a specific embodiment, the number of the spring structure(s) canbe proportional to the number of the capacitor element(s).

Also, the configuration of the central spring structure(s) can depend onthe configuration of the capacitor element(s). The capacitor element(s)can include a fixed capacitor element and a movable capacitor element.The fixed capacitor element(s) can be coupled to the anchor structure(s)and the movable capacitor element(s) can be spatially disposed on aportion of the base surface region within a vicinity of the anchorstructure(s). In a specific embodiment, the physical basis of method 500is to have the anchor(s) for the spring structure(s) and the anchor(s)for the fixed capacitor elements be located as close as possible to eachother so that their deformations will be nearly the same. In a specificembodiment, the differential capacitor element pair(s) can operateduring motion of the movable base structure. The charge on one elementof the pair can increase while the charge on the other complementaryelement can decrease. Each differential pair can also be spatiallydisposed within a vicinity of the inner surface region(s), and each paircan be disposed within a vicinity of its own inner surface region,isolated from other pairs.

In an embodiment, the apparatus can be coupled to another MEMS device oran electronic device. In a specific embodiment, the apparatus can beconfigured to be tolerant of external deformations. The apparatus formedby method 500 can be an integrated transducer apparatus with minimalseparation between anchor structures and thus minimal difference ofstrain or deformation of the anchor structure(s). In some embodiments,this configuration can result in minimal change in sense capacitancevalues over strain and deformation due to temperature. There can beother variations, modifications, and alternatives as well.

The above sequence of processes provides a fabrication method forforming a MEMS transducer apparatus according to an embodiment of thepresent invention. As shown, the method uses a combination of stepsincluding providing a substrate member, forming a movable base, removinga portion of the base, forming anchor structure(s), forming springstructure(s), and forming capacitor element(s).

FIG. 6 illustrates a functional block diagram of various embodiments ofthe present invention. In FIG. 6, a computing device 600 typicallyincludes an applications processor 610, memory 620, a touch screendisplay 630 and driver 640, an image acquisition device 650, audioinput/output devices 660, and the like. Additional communications fromand to computing device are typically provided by via a wired interface670, a GPS/Wi-Fi/Bluetooth interface 680, RF interfaces 690 and driver700, and the like. Also included in various embodiments are physicalsensors 710.

In various embodiments, computing device 600 may be a hand-heldcomputing device (e.g. Apple iPad, Apple iTouch, Dell Mini slate, LenovoSkylight/IdeaPad, Asus EEE series, Microsoft Courier, Notion Ink Adam),a portable telephone (e.g. Apple iPhone, Motorola Droid, Google NexusOne, HTC Incredible/EVO 4G, Palm Pre series, Nokia N900), a portablecomputer (e.g. netbook, laptop), a media player (e.g. Microsoft Zune,Apple iPod), a reading device (e.g. Amazon Kindle, Barnes and NobleNook), or the like.

Typically, computing device 600 may include one or more processors 610.Such processors 610 may also be termed application processors, and mayinclude a processor core, a video/graphics core, and other cores.Processors 610 may be a processor from Apple (A4), Intel (Atom), NVidia(Tegra 2), Marvell (Armada), Qualcomm (Snapdragon), Samsung, TI (OMAP),or the like. In various embodiments, the processor core may be an Intelprocessor, an ARM Holdings processor such as the Cortex-A, -M, -R or ARMseries processors, or the like. Further, in various embodiments, thevideo/graphics core may be an Imagination Technologies processor PowerVR-SGX, -MBX, -VGX graphics, an Nvidia graphics processor (e.g. GeForce),or the like. Other processing capability may include audio processors,interface controllers, and the like. It is contemplated that otherexisting and/or later-developed processors may be used in variousembodiments of the present invention.

In various embodiments, memory 620 may include different types of memory(including memory controllers), such as flash memory (e.g. NOR, NAND),pseudo SRAM, DDR SDRAM, or the like. Memory 620 may be fixed withincomputing device 600 or removable (e.g. SD, SDHC, MMC, MINI SD, MICROSD, CF, SIM). The above are examples of computer readable tangible mediathat may be used to store embodiments of the present invention, such ascomputer-executable software code (e.g. firmware, application programs),application data, operating system data or the like. It is contemplatedthat other existing and/or later-developed memory and memory technologymay be used in various embodiments of the present invention.

In various embodiments, touch screen display 630 and driver 640 may bebased upon a variety of later-developed or current touch screentechnology including resistive displays, capacitive displays, opticalsensor displays, electromagnetic resonance, or the like. Additionally,touch screen display 630 may include single touch or multiple-touchsensing capability. Any later-developed or conventional output displaytechnology may be used for the output display, such as TFT-LCD, OLED,Plasma, trans-reflective (Pixel Qi), electronic ink (e.g.electrophoretic, electrowetting, interferometric modulating). In variousembodiments, the resolution of such displays and the resolution of suchtouch sensors may be set based upon engineering or non-engineeringfactors (e.g. sales, marketing). In some embodiments of the presentinvention, a display output port, such as an HDMI-based port orDVI-based port may also be included.

In some embodiments of the present invention, image capture device 650may include a sensor, driver, lens and the like. The sensor may be basedupon any later-developed or convention sensor technology, such as CMOS,CCD, or the like. In various embodiments of the present invention, imagerecognition software programs are provided to process the image data.For example, such software may provide functionality such as: facialrecognition, head tracking, camera parameter control, or the like.

In various embodiments, audio input/output 660 may include conventionalmicrophone(s)/speakers. In some embodiments of the present invention,three-wire or four-wire audio connector ports are included to enable theuser to use an external audio device such as external speakers,headphones or combination headphone/microphones. In various embodiments,voice processing and/or recognition software may be provided toapplications processor 610 to enable the user to operate computingdevice 600 by stating voice commands.

Additionally, a speech engine may be provided in various embodiments toenable computing device 600 to provide audio status messages, audioresponse messages, or the like.

In various embodiments, wired interface 670 may be used to provide datatransfers between computing device 600 and an external source, such as acomputer, a remote server, a storage network, another computing device600, or the like. Such data may include application data, operatingsystem data, firmware, or the like. Embodiments may include anylater-developed or conventional physical interface/protocol, such as:USB 2.0, 3.0, micro USB, mini USB, Firewire, Apple iPod connector,Ethernet, POTS, or the like. Additionally, software that enablescommunications over such networks is typically provided.

In various embodiments, a wireless interface 680 may also be provided toprovide wireless data transfers between computing device 600 andexternal sources, such as computers, storage networks, headphones,microphones, cameras, or the like. As illustrated in FIG. 6, wirelessprotocols may include Wi-Fi (e.g. IEEE 802.11 a/b/g/n, WiMax),Bluetooth, IR and the like.

GPS receiving capability may also be included in various embodiments ofthe present invention, however is not required. As illustrated in FIG.6, GPS functionality is included as part of wireless interface 180merely for sake of convenience, although in implementation, suchfunctionality is currently performed by circuitry that is distinct fromthe Wi-Fi circuitry and distinct from the Bluetooth circuitry.

Additional wireless communications may be provided via RF interfaces 690and drivers 700 in various embodiments. In various embodiments, RFinterfaces 690 may support any future-developed or conventional radiofrequency communications protocol, such as CDMA-based protocols (e.g.WCDMA), GSM-based protocols, HSUPA-based protocols, or the like. In theembodiments illustrated, driver 700 is illustrated as being distinctfrom applications processor 610. However, in some embodiments, thesefunctionality are provided upon a single IC package, for example theMarvel PXA330 processor, and the like. It is contemplated that someembodiments of computing device 600 need not include the RFfunctionality provided by RF interface 690 and driver 700.

FIG. 6 also illustrates computing device 600 to include physical sensors710. In various embodiments of the present invention, physical sensors710 can be single axis or multi-axis Micro-Electro-Mechanical Systems(MEMS) based devices being developed by M-cube, the assignee of thepresent patent application. Physical sensors 710 can includeaccelerometers, gyroscopes, pressure sensors, magnetic field sensors,bio sensors, and the like. In other embodiments of the presentinvention, conventional physical sensors 710 from Bosch,STMicroelectronics, Analog Devices, Kionix or the like may be used.

In various embodiments, any number of future developed or currentoperating systems may be supported, such as iPhone OS (e.g. iOS),WindowsMobile (e.g. 7), Google Android (e.g. 2.2), Symbian, or the like.In various embodiments of the present invention, the operating systemmay be a multi-threaded multi-tasking operating system. Accordingly,inputs and/or outputs from and to touch screen display 630 and driver640 and inputs/or outputs to physical sensors 710 may be processed inparallel processing threads. In other embodiments, such events oroutputs may be processed serially, or the like. Inputs and outputs fromother functional blocks may also be processed in parallel or serially,in other embodiments of the present invention, such as image acquisitiondevice 650 and physical sensors 710.

FIG. 6 is representative of one computing device 600 capable ofembodying the present invention. It will be readily apparent to one ofordinary skill in the art that many other hardware and softwareconfigurations are suitable for use with the present invention.Embodiments of the present invention may include at least some but neednot include all of the functional blocks illustrated in FIG. 6. Forexample, in various embodiments, computing device 600 may lack imageacquisition unit 650, or RF interface 690 and/or driver 700, or GPScapability, or the like. Additional functions may also be added tovarious embodiments of computing device 600, such as a physicalkeyboard, an additional image acquisition device, a trackball ortrackpad, a joystick, or the like. Further, it should be understood thatmultiple functional blocks may be embodied into a single physicalpackage or device, and various functional blocks may be divided and beperformed among separate physical packages or devices.

These diagrams are merely examples, which should not unduly limit thescope of the claims herein. In light of the present inventiondisclosure, one of ordinary skill in the art would recognize many othervariations, modifications, and alternatives. For example, various stepsoutlined above may be added, removed, modified, rearranged, repeated,and/or overlapped, as contemplated within the scope of the invention. Itis also understood that the examples and embodiments described hereinare for illustrative purposes only and that various modifications orchanges in light thereof will be suggested to persons skilled in the artand are to be included within the spirit and purview of this process andscope of the appended claims.

What is claimed is:
 1. A method of fabricating a transducer apparatus,the method comprising: providing a substrate member having a surfaceregion; forming a movable base structure having a base surface region;removing at least one portion of the movable base structure to form acenter cavity with a cavity surface region; forming at least one centeranchor structure spatially disposed within a substantially circularportion of the surface region, the center anchor structure(s) beingconfigured within a vicinity of the center of the surface region that iswithin the center cavity; forming at least one spring structure coupledto at least one portion of the cavity surface region, the springstructure(s) being coupled to the center anchor structure(s); andforming at least one capacitor element, the capacitor element(s) beingspatially disposed within a vicinity of the cavity surface region. 2.The method of claim 1 wherein the number of the spring structure(s) isproportional to the number of the capacitor element(s).
 3. The method ofclaim 1 wherein the configuration of the spring structure(s) depends onthe configuration of the capacitor element(s).
 4. The method of claim 1wherein the movable base structure comprises a silicon material, apolymer, a dielectric, or a metal material.
 5. The method of claim 1wherein the center anchor structure(s) comprise a silicon material, apolymer, a dielectric, or a metal material.
 6. The method of claim 1wherein the spring structure(s) comprise a silicon material, a polymer,a dielectric, or a metal material.
 7. The method of claim 1 wherein themovable base structure is a rectangular movable base structure.
 8. Themethod of claim 7 wherein the spring structure(s) are spatially orientedto be 45 degrees or (pi/4) radians to the edges of the rectangularmovable base structure.
 9. The method of claim 1 wherein the springstructure(s) are spatially oriented to be 45 degrees or (pi/4) radiansto the edges of a die.
 10. The method of claim 1 wherein the movablebase structure comprises a silicon material, a polymer, a dielectric, ora metal material.
 11. The method of claim 1 wherein the anchorstructure(s) comprises a silicon material, a polymer, a dielectric, or ametal material.
 12. The method of claim 1 wherein the springstructure(s) comprises a silicon material, a polymer, a dielectric, ormetal material.
 13. The method of claim 1 wherein each of the springstructure(s) comprises at least one segment having a segment length. 14.The method of claim 1 wherein the apparatus is operably coupled to aMEMS device or an electronic device.
 15. The method of claim 1configured to fabricate an apparatus tolerant of external deformations.16. A method of fabricating a transducer apparatus, the methodcomprising: providing a substrate member having a surface region;forming a rectangular movable base structure having a base surfaceregion; removing at least one portion of the rectangular movable basestructure to form a center cavity having a cavity surface region;forming four anchor structure spatially disposed within a substantiallycircular portion of the surface region, the center anchor structuresbeing configured within a vicinity of the center of the surface regionwithin the center cavity; forming four spring structures each of whichare coupled to at least one portion of the cavity surface region, thespring structures being coupled to the center anchor structures; andforming at least one capacitor element coupled to each of the centeranchor structures, the capacitor elements being spatially disposedwithin a vicinity of the cavity surface region.
 17. The method of claim16 wherein the number of the spring structures is proportional to thenumber of the capacitor elements.
 18. The method of claim 16 wherein theconfiguration of the spring structures depends on the configuration ofthe capacitor elements.
 19. The method of claim 16 wherein the springstructures are spatially oriented to be 45 degrees or (pi/4) radians tothe edges of the rectangular movable base structure.
 20. The method ofclaim 16 configured to fabricate an apparatus tolerant of externaldeformations.